Analysis Plus Copper Oval in Micro Interconnects XLR mt. 1.5 [2nd hand]

Analysis Plus Copper Oval in Micro Interconnects XLR

Our Copper Oval-In Micro Interconnects deliver high performance in an exceptionally compact cross-sectional design. Three 18 AWG  ( 0.75 mm²) conductors and an FEP dielectric housed within a miniaturized construction provide outstanding performance in a space-saving format.

These interconnects are engineered around our patented hollow oval geometry, developed to optimize current density distribution within a braid-friendly structure made from high-purity oxygen-free copper (OFC). The signal conductors are further enclosed by a shield that ensures effective protection against EMI and RFI interference.

The result is an exceptionally quiet interconnect with a highly neutral sonic character, offering excellent value and performance at a price point accessible to virtually any budget.

Analysis Plus is uniquely qualified as an authority on cable design. The Detroit-based company earned its reputation testing and analyzing cables for leading cable manufacturers whose names you'd recognize in a flash. After examining the best, Analysis Plus decided it could do even better by developing its own proprietary hollow-oval conductor design.

Why the unique conductor geometry? Mark Markel and Qinwei Sun, the chief engineers at Analysis Plus, determined that round cable used in conventional analog cable designs has high levels of current bunching, skin effect phenomenon, and other frequency characteristics that degrade signal quality. Rectangular conductors were a little better, but these suffered high electric field values caused by sharp corners which can also cut into and injure the dielectric when the cable is flexed.

After many computer simulations, Analysis Plus found that a hollow oval cable was the best design due to its minimal change in resistance with frequency, plus other benefits. The company chose a flexible, braided conductor rather than the conventional solid conductor, which is susceptible to kinks and deformations with resulting signal degradation. A unique woven pattern places every wire statistically as close to the return current as every other wire for evenly distributed high-current density and superior sound.